Dual 6-Axis IMUs
Two independent IMU devices provide accelerometer and gyroscope measurements for comparative analysis and motion-sensing development.
WSENSOR / MULTI-SENSOR DEVELOPMENT
Dual IMU & Angle Sensor Module
ICM-42688-P + BMI088 + AS5047P | STM32F446
A multi-sensor development platform integrating two 6-axis IMUs and a magnetic rotary position sensor for inertial measurement, motion analysis, rotary angle feedback research and embedded-system development.
The board pairs ICM-42688-P and BMI088 inertial sensors with an AS5047P magnetic angle sensor, processed by an STM32F446 MCU — three sensing principles on one platform for comparison, calibration and fusion experiments.
Product highlights
Magnetic Rotary Angle Sensing
AS5047P provides contactless magnetic angle measurement for rotary position sensing experiments, subject to suitable magnet installation and configuration.
STM32F446 Processing
An embedded MCU provides the platform for sensor communication and application-specific data acquisition and processing.
Multi-Sensor Development
Explore inertial sensing, rotary position measurement, calibration and sensor-data analysis using one hardware platform.
PCB Views
Front & Back
Genuine product photos with key chip locations marked for reference.
System Architecture
Three Sensing Principles, One Controller
The module combines two different 6-axis IMU devices with a magnetic rotary angle sensor, acquired by the on-board STM32F446.
On-Board Sensors
What Each Sensor Measures
Component-level figures below come from the chip manufacturers. They describe the chips — not verified performance of this module.
Sensor 1 · IMU
ICM-42688-P · TDK InvenSense
MEMS inertial measurement: capacitive sensing of acceleration and Coriolis-based angular-rate measurement.
Measures
- 3-axis acceleration
- 3-axis angular rate (gyroscope)
Key features
- 6-axis IMU in a single package
- Configurable accelerometer full-scale ranges: ±2, ±4, ±8, ±16 g
- Configurable gyroscope full-scale ranges — see the official datasheet for current values
- On-chip digital filtering and configurable performance/power modes
- Chip-level digital interfaces: SPI, I²C and I3C
Typical development uses
- Motion and orientation sensing research
- Inertial navigation and dead-reckoning experiments
- Vibration and motion logging in embedded systems
On this module
Integrated on the module. Which digital interface is wired to the MCU, and which driver support is provided, is subject to schematic and firmware verification.
| Parameter | Value |
|---|---|
| Sensor type | 6-axis IMU (3-axis accelerometer + 3-axis gyroscope)Official source |
| Accelerometer ranges | ±2 / ±4 / ±8 / ±16 g (configurable)Official source |
| Gyroscope ranges | Configurable — see official datasheet for full-scale optionsOfficial source |
| Digital interfaces (chip-level) | SPI, I²C, I3CChip capability only. Which buses this board wires up is a module-level fact to be confirmed.Official source |
Sensor 2 · IMU
BMI088 · Bosch Sensortec
MEMS inertial measurement: capacitive acceleration sensing and Coriolis-based gyroscope sensing, with separate accelerometer and gyroscope dies.
Measures
- 3-axis acceleration
- 3-axis angular rate (gyroscope)
Key features
- 6-axis IMU with physically separate accelerometer and gyroscope dies
- Accelerometer and gyroscope each provide their own configurable measurement ranges — see the official datasheet
- Designed for demanding motion-control applications such as drones and robots
- Chip-level digital interfaces: SPI, I²C
Typical development uses
- Inertial measurement research in vibration-prone platforms
- Sensor comparison, calibration and motion-data analysis
- UAV and robotics motion-sensing development
On this module
Integrated on the module. Bus wiring, driver support and any vibration-environment validation are module-level facts to be confirmed; no vibration test report exists for this board yet.
| Parameter | Value |
|---|---|
| Sensor type | 6-axis IMU (3-axis accelerometer + 3-axis gyroscope)Official source |
| Measurement ranges | Separate configurable accelerometer and gyroscope ranges — see official datasheetOfficial source |
| Digital interfaces (chip-level) | SPI, I²CChip capability only. Which buses this board wires up is a module-level fact to be confirmed.Official source |
Position Sensor
AS5047P · Infineon
Contactless magnetic rotary angle sensing: the chip measures the direction of the magnetic field of a magnet mounted on the rotating part.
Measures
- Rotary angle of a magnet relative to the chip (14-bit maximum, chip level)
Key features
- Magnetic rotary angle sensor — not a GPS, geolocation or 3D-position sensor
- Contactless angle measurement
- Up to 14-bit angle resolution at chip level
- Chip-level output interfaces: SPI, PWM, ABI and UVW
- On-chip angular error correction (dynamic angle error correction)
Typical development uses
- Rotary mechanism and robot-joint angle feedback research
- Evaluation of magnetic encoders as alternatives to optical encoders
- Motor commutation and position-loop experiments
On this module
Integrated on the module and requiring an external magnet with suitable geometry and installation. The sensor is located at reference designator U5 on the back side of the PCB, towards the board center; the annotation overlay on the Back View photo marks its location. Which output interface the board exposes is subject to schematic verification; no on-board electrical wiring for the magnet gap is asserted here.
| Parameter | Value |
|---|---|
| Sensor type | Magnetic rotary angle sensor (contactless)Official source |
| Angle resolution (chip level) | Up to 14 bitChip-level resolution. Real measurement accuracy depends on magnet, mechanical installation, field conditions, calibration and signal processing.Official source |
| Output interfaces (chip-level) | SPI, PWM, ABI, UVWWhich of these the board exposes is a module-level fact to be confirmed independently.Official source |
Main MCU — STM32F446 · STMicroelectronics
Confirmed as the module main controller. Firmware capabilities, release status and flash contents are to be confirmed — the module is a development platform, not a turnkey instrument.
Official STM32F446 pageEngineering Value
Why Two IMUs?
Sensor Characterization
Compare noise, bias, drift, response and repeatability of two IMU families under identical experimental conditions.
Sensor Fusion Research
Study multi-sensor filtering, bias estimation, data consistency checks and application-specific fusion methods.
Experimental Redundancy
Use a second measurement source for sanity checks and experimental fault detection.
Note: two IMUs do not automatically form a safety-grade redundant system. Fault independence, power, timing, communication, software and system validation all affect real reliability.
Complementary Measurements
Inertial Sensing Meets Rotary Angle
IMUs measure
Acceleration and angular rate — how motion changes over time.
AS5047P measures
The rotation angle of a magnet relative to the chip — an absolute-ish orientation observation of the rotary joint.
Experiments this combination supports:
- Angle vs. angular-rate comparison during rotary motion
- Encoder vs. gyroscope response comparison
- Robot joint motion data acquisition
- State-estimation experiments on rotary mechanisms
- Validation of position + inertial measurement algorithms
Engineering notes:
- Sensor fusion requires calibration.
- Different sample rates require time alignment.
- Different coordinate frames require alignment.
- Magnetic angle sensing requires suitable magnet geometry and installation.
- Module-level accuracy must be validated experimentally.
Specifications
Module & Component Levels
Module-level specifications
| Parameter | Value |
|---|---|
| Product Type | Multi-Sensor Development Module |
| IMU 1 | ICM-42688-P |
| IMU 2 | BMI088 |
| Rotary Position Sensor | AS5047P |
| Main MCU | STM32F446 |
| Inertial Measurement | 2 × 6-axis IMU |
| Rotary Angle Measurement | Magnetic rotary angle sensing |
| USB-C | Connector present; supported functions to be verified |
| UART | Board marking present; electrical interface to be verified |
| CAN | Board marking present; transceiver and firmware support to be verified |
| PWM | Board marking present; supported channels and direction to be verified |
| Firmware | To be confirmed — release and available features |
| Board Dimensions | To be measured |
| Input Voltage | To be verified |
| Operating Temperature | To be verified for the complete module |
“To be verified” marks board-level facts pending schematic, firmware or measurement confirmation. They are never filled with assumed default values.
Component-level specifications Component-level specifications
Reference figures from the chip manufacturers. Chip parameters must not be read as measured performance of this module — see each sensor’s section above for sources.
ICM-42688-P — TDK InvenSense
- Sensor type
- 6-axis IMU (3-axis accelerometer + 3-axis gyroscope)
- Accelerometer ranges
- ±2 / ±4 / ±8 / ±16 g (configurable)
- Gyroscope ranges
- Configurable — see official datasheet for full-scale options
- Digital interfaces (chip-level)
- SPI, I²C, I3C
BMI088 — Bosch Sensortec
- Sensor type
- 6-axis IMU (3-axis accelerometer + 3-axis gyroscope)
- Measurement ranges
- Separate configurable accelerometer and gyroscope ranges — see official datasheet
- Digital interfaces (chip-level)
- SPI, I²C
AS5047P — Infineon
- Sensor type
- Magnetic rotary angle sensor (contactless)
- Angle resolution (chip level)
- Up to 14 bit
- Output interfaces (chip-level)
- SPI, PWM, ABI, UVW
Use Cases
Typical Applications
UAV and Flight-Control Research
Explore inertial measurement, vibration behavior and sensor comparison for UAV development.
This module carries no flight-control certification and provides no verified safety-grade redundancy.
Robotics and Mobile Platforms
Study robot motion, inertial measurements, orientation estimation and multi-sensor acquisition.
Joint and Rotary Mechanism Research
Combine rotary angle measurements with inertial data to investigate joint motion, actuator behavior and rotary mechanisms.
Practical use depends on mechanical structure, magnet installation, sensor placement and algorithm implementation.
Embedded Sensor Development
Explore MCU-based sensor communication, data logging, calibration and real-time processing.
Sensor Evaluation and Research
Compare two different IMU families under controlled experimental conditions.
Engineering Education
Provide a practical platform for studying MEMS sensors, rotary position sensing, embedded firmware and estimation algorithms.
Development Workflow
From Bring-Up to Application Validation
Hardware and Interface Verification
Confirm board revision, connectors and pinout against the schematic before wiring anything.
Sensor Communication
Bring up each sensor on its bus and read device IDs to confirm communication.
Raw Data Acquisition
Log unfiltered accelerometer, gyroscope and angle data at known settings.
Timestamp and Sampling Analysis
Check sample rates, jitter and time alignment between the three sensors.
Calibration
Apply zero-offset, scale-factor and misalignment calibration appropriate to each sensor.
Sensor Comparison
Compare the two IMU families under identical experimental conditions.
Filtering and Fusion Experiments
Evaluate complementary, Kalman and other estimators on your own recorded data.
Application Validation
Validate the sensing chain in the target application before drawing conclusions.
This workflow describes the engineering path for this hardware. No driver or firmware package implementing these steps is published yet — see the documentation status below.
Developer Resources
Technical Documentation
The documentation set is planned around the categories below. The first release only publishes files that genuinely exist and have been reviewed — everything not yet available is marked Documentation coming soon, with no placeholder downloads.
Hardware
- Hardware OverviewDocumentation coming soon
- PCB RevisionDocumentation coming soon
- SchematicDocumentation coming soon
- Connector PinoutDocumentation coming soon
- Power RequirementsDocumentation coming soon
- Electrical Interface SpecificationDocumentation coming soon
Sensor Drivers
- ICM-42688-P DriverDocumentation coming soon
- BMI088 DriverDocumentation coming soon
- AS5047P Interface and ConfigurationDocumentation coming soon
Firmware
- STM32F446 FirmwareDocumentation coming soon
- Build InstructionsDocumentation coming soon
- Configuration GuideDocumentation coming soon
- Release NotesDocumentation coming soon
Data and Algorithms
- Raw Data LoggingDocumentation coming soon
- Sensor CalibrationDocumentation coming soon
- Timestamp AlignmentDocumentation coming soon
- IMU ComparisonDocumentation coming soon
- Rotary Angle AnalysisDocumentation coming soon
- Sensor Fusion ExamplesDocumentation coming soon
Test Reports
- Sensor NoiseDocumentation coming soon
- Bias and DriftDocumentation coming soon
- Temperature TestsDocumentation coming soon
- Rotary Angle ValidationDocumentation coming soon
- Timing and SynchronizationDocumentation coming soon
- Vibration TestsDocumentation coming soon
FAQ
Frequently Asked Questions
What sensors are integrated into this module?
The module integrates two 6-axis IMUs — TDK InvenSense ICM-42688-P and Bosch Sensortec BMI088 — plus an Infineon AS5047P magnetic rotary angle sensor, with an STMicroelectronics STM32F446 as the main MCU.
What is the difference between the two IMUs?
Both are 6-axis accelerometer + gyroscope devices, but they are different chips from different manufacturers with different characteristics. That is the point of carrying both: under identical conditions you can compare noise, bias, drift, response and repeatability across two IMU families. Component-level specifications for each are linked from their official datasheets.
What does the AS5047P measure?
The AS5047P measures the rotary angle of a magnetic field — the angular position of a magnet mounted on the rotating part relative to the chip. It is a contactless magnetic rotary angle sensor with up to 14-bit resolution at chip level.
Does AS5047P measure absolute spatial position?
No. It measures one rotational angle of a magnet relative to the sensor, not GPS location and not 3D position in space. It also does not directly measure angular acceleration.
Can two IMUs improve orientation estimation?
Two IMUs give you two independent measurement sources you can compare, cross-check and use in multi-sensor estimators — useful for research on sensor fusion and consistency checking. They do not automatically form a safety-grade redundant system: fault independence, power, timing, communication, software and system-level validation all affect real reliability.
Does the module provide ready-to-use sensor fusion firmware?
No firmware release with confirmed fusion features is available yet. The module is a development platform: firmware release status and available features are to be confirmed, and are listed in the specification table.
Which communication interfaces are available on the board?
The board carries USB-C and header markings for UART, CAN, PWM and I²C. The connector exists on the PCB, but the supported electrical functions of each interface are still to be verified against the schematic and firmware — the specification table states the verification status of each.
Does the AS5047P require an external magnet?
Yes. Magnetic angle sensing requires a diametrically magnetized magnet mounted on the rotating part, with suitable geometry, gap and alignment relative to the chip. Measurement quality depends on that mechanical installation, the field conditions and calibration.
Can the module be used for UAV or robotics development?
It is intended as a research and prototyping platform for UAV- and robotics-related inertial measurement and sensor comparison. It carries no flight-control certification and provides no verified safety-grade redundancy.
Where can I obtain the schematic and firmware?
Hardware documentation and firmware are not published yet. The documentation section lists what is planned; use the inquiry form to request technical documentation and we will follow up on availability.
Is measured module accuracy available?
Not yet. No module-level measured performance (noise, bias stability, angle error, temperature behavior, timing) has been published. Component-level figures come from the chip vendors and must not be read as verified performance of this module.
How can I request technical documentation or a quotation?
Use the inquiry form on this page with your intended application and documentation needs, or contact WSENSOR directly. We answer engineering and procurement inquiries for this module.
Get in Touch
Request Technical Documentation
Tell us about your application and what you need — datasheets, schematic status, firmware plans or a quotation. Engineering and procurement inquiries are answered by the WSENSOR team.